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1/9 www.rohm.com 201 1.08 - rev . a ? 2011 rohm co., ltd. all rights reserved. us b s witch i c s spst t y pe (single pole single throw) bh6260mw x descr ipt i on bh6260mwx is spst x 2ch and inverter x 2ch analog swit ches. analog sw0 and sw1 pass usb 2.0 high-speed signal. analog sw2 and sw3 pass uart signal. moreover, this is gu aranteed from 2.9v to 3.7v as for the range of the power-supply voltage. enable signals enb0, enb1, en2, and en3 can control analog sw0, sw1, sw2, and sw3. furthermore, this is able to pass usb 2.0 high-speed signal without distortion, because of analog sw0 and sw1 are low capacitance. the electrostatic discharge protection circuit is built-in in all terminals. f e atur es 1) 5 switches connect inputs to outputs 2) low capacity analog sw 2ch with clamp diode 3) 1.8v output inverter 2ch 4) 16-pin son package (3.3mm x 1. 5mm, height=0.6mm, 0.4mm pitch) 5) it contributes to the miniaturizati on because all external is built into. a p p lic ati ons digital still cameras, digital video camcorders, portabl e navigation devices, tv, portable dvd players, portable game systems, personal computers, pda, mobile phones lin e up ma tri x parameter bh6260mwx bd11600n ux bd11603mwx bd11601nux supply quiescent current 0 a 18 a 18 a 18 a input voltage range 2.9 3.7 v 2.5 5.5 v 2.5 5.5 v 2.5 5.5 v switch on resistance ( vin=0 v ) 5 3 3 2.5 switch on capacitance 10 pf 6 pf 7 pf 6 pf configuration spst x 2ch and inverter x 2ch dpdt mux x 2lines dpst package uson016x3315 vson010x3020 uson016x3315 vson008x2020 a b solut e maximum r a tings (ta=25 ) parameter symbol ratings unit conditions input supply voltage1 vmax1 -0.3 5.5 v vdd,vdd18,b2,enb0 enb1,en2,en3 input supply voltage2 vmax2 -0.3 vdd+0.3 v a0,b0,a1,b1,a3 input supply voltage3 vmax3 -0.3 vdd18+0.3 v b3 input supply voltage4 vmax4 -0.3 vdd+0.3 v a2 *3 input supply voltage5 vmax5 -0.3 vdd18+0.3 v a2 *4 power dissipation pd 850 mw *1 operating temperatur e range topr -40 +85 storage temperature range tstr -55 +125 *1 when using more than at ta=25 , it is reduced 8.5 mw per 1 . rohm specification board 70mm 70mm mounting. no.11103eat04 downloaded from: http:///
technical note 2/9 bh6260mw x www.rohm.com 201 1.08 - rev . a ? 2011 rohm co., ltd. all rights reserved. op er atin g con d i tio n s (ta=-40 +85 ) parameter symbol ratings unit conditions input voltage range (vdd) vdd 2.9 3.7 v input voltage range (vdd18) vdd18 1.7 3.6 v * this product does not especially desi gned to be protected from radioactivity e l ectr ical charact e rist ics (unless otherwise noted, ta = 25 , vdd=3.3v, vdd18=1.8v) parameter symbol limits unit conditions min. typ. max. to ta l supply quiescent current 1 icc1 - 0 10 ? a vdd=3.3v, enb0/1:l, en2/3:h supply quiescent current 2 icc2 - 0 10 ? a vdd=3.3v, enb0/1:h, en2/3:l switch on resistance 1 ron1 - 5 10 vin=0v switch on resistance 2 ron2 - 8 13 vin=2.4v switch off capacitance (a2, a3) coff - 5.0 - pf f=1mhz switch on capacitance (a0, a1) con - 10 - pf f=1mhz inv2 input l level vilbuf2 - - 0.25 vdd18 v inv2 input h level vihbuf2 0.75 vdd18 - - v inv2 output l level volbuf2 - 0.15 0.3 v io=3ma inv2 output h level vohb uf2 1.50 1.65 - v io=-3ma inv3 input l level vilbuf3 - - 0.25 vdd18 v inv3 input h level vihbuf3 0.75 vdd18 - - v inv3 output l level volbuf3 - 0.15 0.3 v io=3ma inv3 output h level vohb uf3 1.50 1.65 - v io=-3ma enbn/enn input h level vihenb 0.75 vdd - - v enbn/enn input l level vilenb - - 0.25 vdd v inv3 input resister rininv3 50 100 150 k en3:h clamp diode voltage1 vi k1 -1.2 -0.73 - v clamp diode voltage2 vik2 - 0.73 1.2 v a0,b0,a1,b1,a2,a3 propagation delay (*1) tplh, tphl - - 0.25 ns cl=50pf,rl=500 bus enable time (*1) tpzh, tpzl - - 200 ns cl=50pf,rl=500 bus disable time (*1) tphz, tplz - - 200 ns cl=50pf,rl=500 downloaded from: http:///
technical note 3/9 bh6260mw x www.rohm.com 201 1.08 - rev . a ? 2011 rohm co., ltd. all rights reserved. e l ectr ica l cha r act e rist ic curv es (r efer enc e d a t a ) fig.1 eye pattern full speed fig.2 eye pattern high speed fig.3 icc vs input voltage (sw off) fig.4 icc vs input voltage (sw on) fig.5 ron vs input voltage 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 0.0 -0.5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 d+, d- signals, v time (x10* -8) s 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 -0.4 -0.5 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 differential signals, v time (x10* -9) s 1.8 2.0 -0.3 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 vdd ( v) ivdd (u a ) ta=-60c ta=25c ta=105c 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 vdd ( v) ivdd (u a ) ta=-60c ta=25c ta=105c 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 8 8.5 9 9.5 10 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 a0 ( v ) ro n ( ? ) ta=-60c ta=25c ta=105c downloaded from: http:///
technical note 4/9 bh6260mw x www.rohm.com 201 1.08 - rev . a ? 2011 rohm co., ltd. all rights reserved. b l ock di agr am a n d pi n c onfig ur ati o n p a ck ag e dim ens io ns fig.6 block diagram fig.7 pin configuration fig.8 package dimensions b h 6 260 lot no. n n n gn n n gn in in n g n g n g n g downloaded from: http:///
technical note 5/9 bh6260mw x www.rohm.com 201 1.08 - rev . a ? 2011 rohm co., ltd. all rights reserved. p i n desc ri ptio n pin no. terminal circuit pin name i/o function 16 - vdd - power supply. 9 - vdd18 - power supply for inv2,3 8 - gnd - ground pin 3,6 4,7 a a 0~1 b 0~1 i/o analog sw0,1 terminal 11 b a2 o inv2 output 14 c a3 i inv3 input 10 d b2 i inv2 input 13 e b3 o inv3 output 2,5 f enb 0-1 i analog sw0-1 on/off pin. (enbn is low : analog sw is on.) 12,15 f en 2-3 i analog sw2-3 on/off pin. (enn is high : analog sw is on.) a p p lic ati on c i rc uit uart signal enb0 en3 vdd18 100k ? enb1 cnt block enb0 en3 en2 enb1 uart block usb block b0 b3 b1 b2 vddvdd18 vdd vdd18 a 0 a 3 a 1 a 2 gnd usb/uart connector en2 vdd18 cnt block uart block usb block low capacitance switch each enable signal downloaded from: http:///
technical note 6/9 bh6260mw x www.rohm.com 201 1.08 - rev . a ? 2011 rohm co., ltd. all rights reserved. eq ui va le n t c i rcui t a pad vdd a0,a1 b0,b1 vdd vdd pad b a2 vdd vdd 10k 10k c a3 vdd 100k vdd 10k 10k b2 d vdd18 10k f vdd 10k pad enb0 enb1 en2 en3 b3 e vdd downloaded from: http:///
technical note 7/9 bh6260mw x www.rohm.com 201 1.08 - rev . a ? 2011 rohm co., ltd. all rights reserved. n o te s fo r use (1) absolute maximum ratings if applied voltage (vcc1, vcc2), operating temperature range (topr), or other absolute maximum ratings are exceeded, there is a risk of damage. since it is not possible to identify shor t, open, or other damage modes, if special modes in which absolute maximum ratings are exceeded ar e assumed, consider applyi ng fuses or other physical safety measures. (2) recommended operating range this is the range within which it is possible to obtai n roughly the expected characteristics. for electrical characteristics, it is thos e that are guaranteed under the conditions for ea ch parameter. even when these are within the recommended operating range, voltage and te mperature characteristics are indicated. (3) reverse connection of power supply connector there is a risk of damaging the lsi by reverse connection of t he power supply connector. for protection from reverse connection, take measures such as externally placing a diode between the power supply and the power supply pin of the lsi. (4) power supply lines in the design of the board pattern, make power supply an d gnd line wiring low impedance. when doing so, although the digital power supply and analog power supply are the same potential, separate the digital power supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due to the common impedance of the wiring patterns. similarly take pattern desi gn into account for gnd lines as well. furthermore, for all power supply pins of the lsi, in conjunction with insert ing capacitors between power supply and gnd pins, when using electrolytic capacitors, determine constants upon adequa tely confirming that capacitance loss occurring at low temperatures is not a problem for various characteristics of the capacitors used. (5) gnd voltage make the potential of a gnd pin such t hat it will be the lowest potential ev en if operating below that. in addition, confirm that there are no pins for wh ich the potential becomes less than a g nd by actually including transition phenomena. (6) shorts between pins and misinstallation when installing in the set board, pay adequate attention to ori entation and placement discrepancies of the lsi. if it is installed erroneously, there is a risk of lsi damage. there also is a risk of damage if it is shorted by a foreign substance getting between pins or between a pin and a power supply or gnd. (7) operation in strong magnetic fields be careful when using the lsi in a strong magnetic field, since it may malfunction. (8) inspection in set board when inspecting the lsi in the set board, since there is a risk of stress to t he lsi when capacitors are connected to low impedance lsi pins, be sure to discharge for each process. moreover, when getting it on and off of a jig in the inspection process, always connect it after turning off the power supply, perform the inspection, and remove it after turning off the power supply. furthermore, as countermeasures against static electricity, use grounding in the assembly process and take appropriate care in transport and storage. (9) input pins parasitic elements inevitably are formed on an lsi struct ure due to potential relationships. because parasitic elements operate, they give rise to interference with ci rcuit operation and may be the cause of malfunctions as well as damage. accordingly, take care not to apply a lower voltage than gnd to an input pin or use the lsi in other ways such that parasitic elements operate. moreover, do not a pply a voltage to an input pin when the power supply voltage is not being applied to the lsi. furthermore, when the power supply voltage is being applied, make each input pin a voltage less than the power supply voltage as well as within the guaranteed values of electrical characteristics. (10) ground wiring pattern when there is a small signal gnd and a large current gnd, it is recommended that you separate the large current gnd pattern and small signal gnd pattern and provide single point grounding at the referenc e point of the set so that voltage variation due to resistance components of the pattern wiring and large currents do not cause the small signal gnd voltage to change. take care that the gnd wiring pattern of externally attached components also does not change. (1 1) externally attached capacitors when using ceramic capacitors for externally attached ca pacitors, determine constants upon taking into account a lowering of the rated capacitance due to dc bias and capa citance change due to factors such as temperature. (12) thermal design perform thermal design in which there ar e adequate margins by taking into account the permissible dissipation (pd) in actual states of use. downloaded from: http:///
technical note 8/9 bh6260mw x www.rohm.com 201 1.08 - rev . a ? 2011 rohm co., ltd. all rights reserved. p o w e r dissip a tion i [] p iii p [] _= p= fig.10 power dissipation downloaded from: http:///
technical note 9/9 bh6260mw x www.rohm.com 201 1.08 - rev . a ? 2011 rohm co., ltd. all rights reserved. or der in g p a rt n u mb er b h 6 2 6 0 m w x - e 2 part no. part no. ??` mwx:uson016x3315 packaging and forming specification e2: embossed tape and reel downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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